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TPCE636-11R

TPCE636 – PCIe FPGA Card with 16-Ch Analog Input and 16-Ch Analog Output by TEWS Technologies

The TEWS Technologies TPCE636 is a half-length PCIe x4 module featuring a user-configurable Xilinx Kintex 7 FPGA with 16 x 16-bit differential ADC input channels at 5 Msps and 16 x 16-bit factory-calibrated DAC output channels with ±10V single-ended output. With 1 GB DDR3 SDRAM, 64 FPGA back I/O lines, four Multi-Gigabit Transceivers via Samtec FireFly, and software support for Linux, Windows, VxWorks, QNX, and Integrity, it is designed for high-speed signal processing, test and measurement, and real-time control in defence and industrial applications. Available from Recab, your Nordic partner for TEWS Technologies embedded I/O solutions.
Description
The TEWS Technologies TPCE636 is a half-length PCIe x4 reconfigurable FPGA module based on the Xilinx Kintex 7 FPGA — available in XC7K160T, XC7K325T, and XC7K410T options — designed for engineers who need high-speed, high-precision analog signal acquisition and generation combined with the flexibility of user-programmable FPGA logic in a PCIe form factor. The 16 ADC input channels are based on the Linear LTC2323-16 dual 16-bit differential ADC running at up to 5 Msps per channel, with analog input circuits accommodating up to ±10V per input pin (±20V differential), and all channels are factory calibrated. The 16 DAC output channels use the Analog Devices AD5547 dual 16-bit DAC, each delivering a single-ended bipolar ±10V output with factory calibration. The user FPGA is connected to a 1 GB, 32-bit wide DDR3 SDRAM bank via an internal Kintex 7 memory controller, enabling high-throughput data buffering for demanding signal processing applications. Customer-specific I/O extension or inter-board communication is supported through 64 FPGA I/Os on a rear 68-pin ERNI SMC connector (configurable as 64 single-ended LVCMOS25 or 32 differential LVDS25) and four FPGA Multi-Gigabit Transceivers on a Samtec FireFly connector. FPGA configuration is via SPI flash with Xilinx Tandem Configuration support, and in-circuit debugging is available via a JTAG header. User applications are developed with Vivado Design Suite. Software drivers are available for Linux, Windows, VxWorks, QNX, and Integrity. The TPCE636 operates from -40 to +85 °C with an MTBF of 240,000 hours and is an excellent fit for defence signal processing, industrial test and measurement, real-time control, and simulation across the Nordic and Baltic regions. Available from Recab, your Nordic partner for TEWS Technologies embedded I/O solutions.
Features
  • 16 differential 16-bit ADC input channels at 5 Msps each with ±20V differential input range
  • 16 factory-calibrated 16-bit DAC output channels with ±10V single-ended bipolar output
  • User-configurable Xilinx Kintex 7 FPGA options: XC7K160T, XC7K325T, or XC7K410T
  • 1 GB 32-bit DDR3 SDRAM connected to FPGA via internal Kintex 7 memory controller
  • 64 FPGA back I/O lines on ERNI SMC connector and 4 MGTs on Samtec FireFly connector
  • Operating temperature -40 to +85 °C with MTBF of 240,000 hours per MIL-HDBK-217F
Specifications
Form Factor half-length X4 PCIe
Board Size 153 mm x 98 mm
FPGA Xilinx XC7K325T
Analog Inputs 16 differential inputs
Analog Outputs 16 differential outputs
Temperature -40°C to +85°C
MTBF 240000h
DDR3 SDRAM 1GB
ADC Resolution 16-bit
DAC Output ±10V
  • Defence signal processing systems requiring high-speed 16-channel ADC and DAC on PCIe
  • Industrial test and measurement platforms using reconfigurable FPGA with precision analog I/O
  • Real-time control and simulation systems needing Kintex 7 FPGA with factory-calibrated analog
  • Research and radar systems requiring PCIe FPGA boards with Multi-Gigabit Transceiver connectivity