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TXMC639-11R

TXMC639 – XMC FPGA Module with 16-Ch Analog Input, 8-Ch Analog Output by TEWS Technologies

The TEWS Technologies TXMC639 is a single-width XMC module featuring a user-configurable AMD Kintex 7 FPGA with up to 16 differential 16-bit ADC input channels at 1.5 Msps, up to 8 single-ended 16-bit DAC output channels with ±10V programmable output, 32 digital TTL I/O lines, and 1 GB DDR3L SDRAM. With P14 and P16 rear I/O, four Multi-Gigabit Transceivers, and software support for Linux, Windows, VxWorks, QNX, and Integrity, it is built for defence, industrial signal processing, and real-time control applications. Available from Recab, your Nordic partner for TEWS Technologies embedded I/O solutions.
Description
The TEWS Technologies TXMC639 is a single-width Switched Mezzanine Card (XMC) module built around a user-configurable AMD Kintex 7 FPGA — available as XC7K160T (-10R) or XC7K325T (-11R) — delivering a comprehensive analog and digital I/O platform for defence signal processing, industrial automation, and real-time control system designers. The ADC input channels are based on the Linear LTC2320-16 octal 16-bit 1.5 Msps differential ADC: the TXMC639-11R provides 16 channels while the TXMC639-10R provides 8, with configurable differential input voltage ranges of ±20.57V, ±10.28V, or ±5.14V and factory correction values for gain and offset error. DAC output channels use the Analog Devices AD5547 dual 16-bit DAC: the TXMC639-11R provides 8 outputs and the TXMC639-10R 4, each with programmable output ranges of ±10V, ±5V, or ±2.5V and 1 µs typical full-scale settling time. Thirty-two ESD-protected TTL I/O lines are individually programmable as input or output, with 16 lines optionally switchable to RS422 differential interface with individual internal terminations. For rear I/O expansion and inter-board communication, P14 provides 64 single-ended or 32 differential FPGA I/O lines, and P16 hosts four Multi-Gigabit Transceivers. The user FPGA connects to 1 GB DDR3L SDRAM via an internal Kintex 7 memory controller. FPGA configuration uses serial SPI flash with AMD Tandem Configuration support, and JTAG in-circuit debugging is available. Software drivers cover Linux, Windows, VxWorks, QNX, and Integrity. The TXMC639 operates from -40 to +85 °C with an MTBF of 157,000 hours. Available from Recab, your Nordic partner for TEWS Technologies embedded I/O solutions.
Features
  • Up to 16 differential 16-bit ADC channels at 1.5 Msps with configurable ±20.57V input range
  • Up to 8 single-ended 16-bit DAC channels with programmable ±10V, ±5V, or ±2.5V output
  • 32 ESD-protected TTL I/O lines with 16 optionally switchable to RS422 with termination
  • AMD Kintex 7 FPGA (XC7K160T or XC7K325T) with 1 GB DDR3L SDRAM memory controller
  • P14 rear I/O with 64 FPGA lines and P16 hosting four Multi-Gigabit Transceivers
  • Operating temperature -40 to +85 °C with 157,000 hours MTBF per MIL-HDBK-217F
Specifications
FormFactor Standard single width XMC
Size 149 mm x 74 mm
PCIe Base Specification 2.1
AnalogIn Up to 16 Differential 16bit
AnalogOut Up to 8 single-ended
DigitalIO 32 TTL compatible lines
Memory 1GB DDR3 SDRAM
Temperature -40°C to +85°C
MTBF 157000h
Compliance RoHS Compliant
  • Defence XMC signal processing systems requiring high-precision 16-channel ADC and DAC
  • Industrial real-time control platforms using reconfigurable Kintex 7 FPGA with analog I/O XMC
  • Test and measurement systems combining 16-bit ADC acquisition with programmable DAC output
  • Radar and sonar signal processing platforms needing XMC FPGA with Multi-Gigabit Transceivers