AIW-173BQ – Wi-Fi 7 + Bluetooth 5.3 M.2 Module by Advantech

The Advantech AIW-173BQ is a high-performance embedded wireless module designed for next-generation industrial and commercial applications requiring Wi-Fi 7 and Bluetooth 5.3 connectivity. Built around the Qualcomm WCN7851 chipset, this module delivers IEEE 802.11be/ax/ac/b/g/n wireless standards with groundbreaking 6GHz band support and Multi-Link Operation capabilities for superior throughput, lower latency, and improved reliability in demanding environments. The module features a 2Tx/2Rx antenna configuration using dual IPEX MHF4 connectors, enabling robust wireless performance across multiple frequency bands simultaneously through Dual Band Dual Concurrent operation. Available in M.2 2230 E Key form factor, the AIW-173BQ provides PCIe interface for Wi-Fi and USB or UART options for Bluetooth connectivity, ensuring flexible integration with various host platforms including Rockchip, Nvidia, and NXP processors. The module operates on 3.0 to 3.3V DC power and supports an extended temperature range from -40 to 85°C, making it suitable for harsh industrial environments. Comprehensive security is ensured through 64/128-bit WEP, WPA, WPA2, WPA3, and 802.1x authentication protocols. Compatible with Windows 11 and Linux operating systems, the AIW-173BQ serves diverse applications including industrial automation, IoT gateways, digital signage, medical devices, transportation systems, and edge computing platforms where reliable high-speed wireless connectivity is essential. The module is also available in LGA 1620 and Full-size MiniPCIe form factors for additional design flexibility. Available from Recab, your Nordic partner for Advantech embedded wireless solutions.