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Hermes (TR LBx/6sd)

Hermes TR LBx/6sd – Rugged 3U VPX I/O Intensive PIC by Concurrent Technologies

The Concurrent Technologies Hermes (TR LBx/6sd) is a rugged 3U VPX Plug In Card built on the 13th Generation Intel Core i7-13800HRE 14-core processor, designed for I/O intensive processing in defence, aerospace, and mission-critical applications. Aligned with the SOSA Technical Standard, it features a 100GBASE-KR4 Ethernet data plane, PCIe Gen 4 expansion, and 64GB soldered LPDDR5 IBECC DRAM. Available in conduction-cooled and Air Flow Thru versions operating from -40°C to +85°C, the Hermes delivers high-density compute and networking capability for demanding embedded systems. Available from Recab, your Nordic partner for Concurrent Technologies embedded computing solutions.
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Description
The Concurrent Technologies Hermes (TR LBx/6sd) is a rugged 3U VPX Plug In Card (PIC) engineered for compute and I/O intensive applications in defence, aerospace, signals intelligence, and mission-critical embedded systems. It is based on the 14-core Intel Core i7-13800HRE 13th Generation processor with Intel Iris Xe Gen 12 graphics and 64GB of soldered LPDDR5 IBECC DRAM providing in-band ECC and single-bit error correction for high-integrity operation. The Hermes is designed in alignment with the SOSA Technical Standard for I/O intensive processor PICs and complies with two OpenVPX module profiles, making it straightforward to integrate into standards-based VPX chassis for defence and aerospace programmes. The data plane provides a 100GBASE-KR4 Ethernet port via P1, configurable to support 25GBASE-KR or 4x10GBASE-KR, implemented via Intel Ethernet Controller E810, with IEEE 1588 Precision Time Protocol support for synchronised networking. Control plane Ethernet is provided by up to 2x10GBASE-KR ports via P1 and a 2.5GBASE-T port via P2 with TSN support. A PCIe Gen 4 x4 expansion plane enables high-speed communication with adjacent boards, and an optional XMC site adds further I/O flexibility via VITA 42.0 with PCIe Gen 1 through Gen 3. Storage options include an M.2 2242 NVMe SSD module with Opal 2.0 security encryption and write protection. Board security encompasses TPM 2.0, Total Memory Encryption, ROP Attack Prevention, and optional sanitisation software. Available in conduction-cooled (VITA 47 Class CC3 and CC4) and Air Flow Thru versions operating from -40°C to +85°C, the Hermes supports Linux and Windows with UEFI Secure Boot and Intel Boot Guard. Available from Recab, your Nordic partner for Concurrent Technologies embedded computing solutions.
Features
  • The 14-core Intel Core i7-13800HRE 13th Generation processor with 64GB soldered LPDDR5 IBECC DRAM delivers high-density compute with in-band ECC for safety-critical embedded applications.
  • A 100GBASE-KR4 configurable Ethernet data plane with IEEE 1588 Precision Time Protocol support enables high-throughput, time-synchronised networking across VPX backplanes.
  • SOSA Technical Standard alignment with two OpenVPX module profile options simplifies integration into standards-based defence and aerospace VPX system architectures.
  • An optional XMC site (VITA 42.0) with PCIe Gen 1 to Gen 3 and rear I/O connectivity provides flexible additional I/O resources without consuming an additional VPX slot.
  • TPM 2.0 with Total Memory Encryption, ROP Attack Prevention, and optional sanitisation software delivers multi-layer board-level security for classified and sensitive applications.
  • Conduction-cooled versions are rated to VITA 47 Class CC4 at -40°C to +85°C with shock and vibration performance to VITA 47 Class OS2 and Class V3 respectively.
Specifications
Processor Intel Core i7-13800HRE
DRAM 64 Gbytes LPDDR5 IBECC
Ethernet 1x 100GBASE-KR4
PCIe x4 Gen 4 PCI Express
Operating Temp -40°C to +70°C
Storage Optional M.2 SSD Site
Graphics DisplayPort v1.2
Power +12 V 3.8 A
Humidity Relative Humidity
Altitude -1,500 to 60,000 feet
  • Defence signals intelligence and electronic warfare processing in VPX chassis
  • Aerospace mission computer applications requiring SOSA-aligned 3U VPX modules
  • Radar and sensor fusion processing in conduction-cooled embedded systems
  • Navy and ground vehicle C4ISR systems requiring high-speed Ethernet data planes

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