EMBC-CECT6 – COM Express Compact AI Solution by Advantech

The EMBC-CECT6 by Advantech is a COM Express Compact solution engineered for mission-critical AI applications in harsh environments. Featuring 13th Generation Intel Core i7 processor with MXM GPU support, 64GB dual-channel LPDDR5 on-board memory, and 1TB on-board NVMe storage with M.2 2242 expansion capability. This rugged computing platform operates across wide temperature ranges from -40°C to 85°C and accepts 9-15V input voltage while meeting MIL-STD-202H shock and vibration standards. The modular design enables quick CPU and GPU performance upgrades with customizable I/O board functions. Available from Recab, your Nordic partner for Advantech embedded computing solutions.

manufacturer

Advantech

product model

EMBC-CECT6

Overview

The EMBC-CECT6 by Advantech represents a high-performance COM Express Compact solution specifically designed for mission-critical AI applications operating in the most demanding environments. Built around the powerful 13th Generation Intel Core i7 processor combined with MXM GPU capabilities, this compact computing platform delivers extraordinary processing power for AI inference, machine vision, and edge computing workloads. The system features 64GB of dual-channel LPDDR5 on-board memory ensuring rapid data processing, complemented by 1TB on-board NVMe storage with additional M.2 2242 expansion slot for enhanced storage flexibility. Engineered for reliability in harsh conditions, the EMBC-CECT6 operates across an extended temperature range of -40°C to 85°C and accepts wide voltage input from 9V to 15V, making it suitable for deployment in defense, unmanned systems, and field operations. Compliance with MIL-STD-202H standards for shock and vibration ensures dependable performance in mobile and rugged installations. The modular architecture comprises a layered system structure measuring 95mm x 95mm x 65mm, incorporating separate I/O board, MXM carrier board, and thermal solution components. This design philosophy enables quick and easy CPU and GPU performance upgrades while allowing customizable I/O board configurations to meet specific application requirements. Connectivity options include 5x MiniDP display outputs, 2x Ethernet ports, 2x USB 3.2 Gen 1, 4x USB 2.0, SATA interface, and comprehensive GPIO capabilities. Optional peripherals include Hailo AI accelerator modules for enhanced neural network inference performance. Ideal applications span autonomous vehicles, unmanned aerial systems, military command and control, satellite communications, and industrial edge AI deployments requiring compact form factors with exceptional computing density. Available from Recab, your Nordic partner for Advantech embedded computing solutions.
Compact, Easy Maintenance, Edge AI Ready, Expandable, Extended Input Voltage, Flexible I/O, High Performance, Modular, Rugged Design, Wide Temperature

Key highlights

Features

  • 13th Generation Intel Core i7 processor with MXM GPU delivers high AI performance.
  • Dual channel LPDDR5 on-board memory provides 64GB for demanding workloads.
  • Wide operating temperature range from -40°C to 85°C enables harsh environment deployment.
  • MIL-STD-202H compliance ensures reliable operation under shock and vibration conditions.
  • Modular design allows quick CPU and GPU upgrades without complete system replacement.
  • Compact 95mm x 95mm x 65mm form factor maximizes computing density in space-constrained applications.

Specifications

Processor 13th Generation Intel Core i7
GPU MXM GPU
Memory Dual Channel LPDDR5 64GB On-Board
Storage On-Board NVMe 1TB with M.2 2242 NVMe Expansion
Operating Temperature -40° ~ 85°C
Input Voltage 9 ~ 15V
Shock and Vibration MIL-STD-202H Compliant
Dimensions 95mm x 95mm x 65mm
Display Output 5 x MiniDP
Ethernet 2 x Ethernet
USB 3.2 2 x USB 3.2 Gen 1
USB 2.0 4 x USB 2.0
Serial 2 x 2-Wire COM
GPIO 4 x GP-in, 4 x GP-out
Interfaces 1 x I2C, 1 x SMBus

Applications

  • Autonomous unmanned aerial vehicle navigation and control systems
  • Military command and control mobile computing platforms
  • Satellite ground station signal processing and communications
  • Industrial edge AI inference for machine vision applications

Resources

Datasheet

https://recab.com/wp-content/uploads/2026/09/Embedded-Core-Flyer0306.pdf