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FLYC-300

FLYC-300 Series – Low-SWaP AI Mission Computer by Neousys Technology

The Neousys Technology FLYC-300 Series is a lightweight 297-gram AI mission computer powered by the NVIDIA Jetson Orin NX module delivering up to 100 TOPS, purpose-built for UAV and UGV applications. It combines 2x GMSL2 camera ports, dual Ethernet, dual USB 3.2, CAN bus, UART, isolated GPIO, and 4G/5G expansion in a 124 x 123 x 29.8mm board, supporting 4S to 14S drone battery packs and MIL-STD-810H vibration and shock ratings. Available from Recab, your Nordic partner for Neousys Technology edge AI solutions.
Description
The Neousys Technology FLYC-300 Series is an ultra-lightweight AI mission computer designed specifically for integration into unmanned aerial vehicles (UAV) and unmanned ground vehicles (UGV), where Size, Weight, and Power (SWaP) constraints are as critical as computational capability. Weighing just 297 grams excluding enclosure and measuring 124 x 123 x 29.8mm, the FLYC-300 is built around the NVIDIA Jetson Orin NX system-on-module, available in 8GB (up to 100 TOPS) and 16GB configurations, with a 1024-core NVIDIA Ampere GPU and ARM Cortex-A78AE CPU providing the AI inference performance needed for autonomous navigation, obstacle avoidance, and real-time object detection and tracking. Camera connectivity is a particular strength, with 2x GMSL2 FAKRA Z connectors supporting HDR and 3D cameras at up to 1920×1080 at 60FPS or 2880×1860 at 30FPS per channel, complemented by 1x GbE and 1x 2.5GbE Ethernet for RGB, infrared, and hyperspectral camera streams, plus 1x USB 3.2 Gen 2 and 1x USB 3.2 Gen 1 for lidar and radar sensor connection. Flight controller communication is handled via configurable UART and CAN bus 2.0 interfaces, with isolated 2x DI and 4x DO GPIO. Storage and expansion use an M.2 2230 M-key NVMe Gen4 x4 slot and an M.2 3042/3052 B-key slot with internal micro SIM for 4G/5G module installation. The XT-30 DC input supports 4S to 14S LiPo battery packs from 12 to 60VDC. Operating temperature reaches -25 to +60°C with heat spreader attachment and -25 to +40°C without, with MIL-STD-810H Method 514.8 vibration and Method 516.8 shock qualification. CE and FCC Class A certified to EN 55032 and EN 55035, with EN 62368-1 safety compliance. Available from Recab, your Nordic partner for Neousys Technology edge AI solutions.
Features
  • NVIDIA Jetson Orin NX delivers up to 100 TOPS AI inference on a 1024-core Ampere GPU at just 297 grams total weight.
  • Two GMSL2 FAKRA Z connectors support HDR and 3D cameras at up to 1920x1080 60FPS or 2880x1860 30FPS per channel.
  • Dual Ethernet, dual USB 3.2, UART, CAN bus 2.0, and isolated GPIO enable comprehensive UAV sensor and controller integration.
  • M.2 B-key slot with micro SIM supports 4G/5G module installation for real-time image and data transmission in flight.
  • Wide 12 to 60VDC XT-30 input accepting 4S to 14S battery packs integrates directly with standard drone power systems.
  • MIL-STD-810H vibration and shock qualification with -25 to +60°C operating range confirms suitability for unmanned vehicle deployments.
Specifications
Processor NVIDIA Jetson Orin NX
Memory 8GB/16GB LPDDR5
Ethernet 1x GbE, 1x 2.5GbE
USB 1x USB 3.2 Gen2, 1x USB 3.2 Gen1
Temperature -25°C to 70°C
Weight 297g
Dimensions 124mm x 123mm x 30.5mm
Storage M.2 2230 NVMe
Power 12V to 60V DC
Humidity 10%~90% Non-Condensing
  • UAV drone AI payload processing for autonomous navigation, obstacle avoidance, and object tracking
  • UGV autonomous ground vehicle onboard AI computing for perception and sensor fusion applications
  • Drone imagery collection and environmental monitoring with multi-camera GMSL2 and hyperspectral sensor support
  • Edge AI inference for infrastructure inspection UAVs requiring lightweight MIL-STD-810H qualified computing