SOM-M250 – COM HPC Mini Module Intel Core Ultra 300 by Advantech

The Advantech SOM-M250 is a COM HPC Mini v1.2 computer-on-module powered by Intel Core Ultra 300 series processors (Panther Lake-H) with up to 16 cores and 25W TDP. This high-performance module features Intel Xe3 graphics with up to 192 execution units, integrated NPU for AI acceleration, dual-channel LPDDR5x memory up to 64GB at 9600MT/s with IBECC support, and PCIe Gen5 expansion. The module supports wide temperature operation from -40 to 85°C, dual 2.5GbE networking, USB4 connectivity, onboard NVMe SSD up to 1TB, and AS9100 compliance for aerospace applications. Available from Recab, your Nordic partner for Advantech computer-on-module solutions.

manufacturer

Advantech

product model

SOM-M250
AS9100

Overview

The Advantech SOM-M250 is a cutting-edge COM HPC Mini v1.2 computer-on-module designed for demanding embedded applications requiring exceptional processing power and AI capabilities. Built on Intel Core Ultra 300 series processors codenamed Panther Lake-H, this module delivers up to 16 cores in a hybrid architecture combining Performance, Efficient, and Low Power Efficient cores with a configurable 25W TDP. The integrated Intel Xe3 graphics engine provides up to 192 execution units with hardware acceleration for video encoding and decoding including AV1 and VVC/H266 codecs, while the built-in NPU enables edge AI workloads with up to 122 graphic pTOPs on the top-tier configuration. Memory performance is exceptional with dual-channel LPDDR5x support running at speeds up to 9600MT/s and maximum capacity of 64GB with In-Band ECC for data integrity. The SOM-M250 offers comprehensive connectivity including PCIe Gen5 x8 expansion, dual 2.5 Gigabit Ethernet ports, up to four USB4 ports, USB 3.2 Gen2, and onboard NVMe SSD storage up to 1TB via PCIe Gen4 x4. Display capabilities include triple simultaneous independent displays through eDP and dual DisplayPort/HDMI outputs supporting resolutions up to 4096×2304 at 60Hz. Additional features include MIPI-CSI camera interfaces, CAN bus, TPM 2.0 security, and comprehensive GPIO options. The module operates across standard 0 to 60°C and extended -40 to 85°C temperature ranges with wide input voltage support from 8.5V to 20V, making it suitable for industrial automation, edge computing, machine vision, defense applications, and critical infrastructure deployments. AS9100 compliance ensures quality standards for aerospace and defense markets. Available from Recab, your Nordic partner for Advantech computer-on-module solutions.
AI Accelerated, CAN Bus, Compact, Edge AI Ready, Expandable, Extended Input Voltage, Flexible I/O, High Performance, Wide Temperature

Key highlights

Features

  • Intel Core Ultra 300 series processors with up to 16 cores and 25W configurable TDP
  • Integrated Intel Xe3 graphics with up to 192 execution units and hardware codec support
  • Built-in NPU for AI acceleration delivering up to 122 graphic pTOPs performance
  • Dual-channel LPDDR5x memory supporting up to 64GB at 9600MT/s with IBECC
  • PCIe Gen5 x8 expansion with additional PCIe Gen4 lanes for high-speed connectivity
  • Wide temperature operation from minus 40 to 85 degrees Celsius with AS9100 compliance

Specifications

Form Factor COM HPC Mini v1.2
CPU Options Intel Core Ultra 9 388H/386H, Core Ultra 7 366HRE, Core Ultra 5 336HRE/335RE/325
Max Cores 16C (4P+8E+4LPE)
Default TDP 25W
Memory LPDDR5x, Dual Channel, Up to 64GB, 9600 MT/s, IBECC
Graphics Intel Xe LPG, Up to 192EU, Max 2.25GHz
PCIe Expansion 1x PCIe Gen5 x8, 1x PCIe Gen4 x4, 6x PCIe Gen4 x1
Ethernet 2x 2.5GbE LAN
USB Up to 4x USB4, 4x USB3.2 Gen2, 8x USB2.0
Display Outputs 1x eDP, 2x DisplayPort/HDMI 2.1, Triple Independent Display
Onboard Storage NVMe SSD up to 1TB via PCIe Gen4 x4
Supply Voltage Vin: 8.5V ~ 20V; VSB: 4.75V ~ 5.25V
Operating Temperature Standard: 0 ~ 60°C; Extended: -40 ~ 85°C
Dimensions 95 mm x 70 mm (3.74" x 2.75")
Security TPM 2.0

Applications

  • Edge AI and machine vision systems requiring integrated NPU acceleration
  • Industrial automation platforms demanding high-performance embedded computing
  • Defense and aerospace systems requiring AS9100 compliant computing modules
  • Critical infrastructure applications needing wide temperature rugged operation

Resources

Datasheet

https://recab.com/wp-content/uploads/2026/09/SOM-M250_DS06152620260615132857.pdf