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SOM-5883 – Intel 11th Gen COM Express Type 6 Module by Advantech

The Advantech SOM-5883 is a high-performance COM Express Basic Type 6 module featuring Intel 11th Gen Core processors (Tiger Lake-H) with up to 8 cores and 16 threads. This compact module delivers exceptional computing power with Intel Iris Xe graphics supporting quad independent 4K displays, dual-channel DDR4 memory up to 128GB with ECC support, and advanced I/O including PCIe Gen4 x16, USB 3.2 Gen2, 2.5GbE Ethernet, and SATA3. The SOM-5883 includes TPM 2.0 security protection and optional onboard NVMe SSD for fast, vibration-resistant storage. Operating temperature ranges from standard 0-60°C to extended -40 to 85°C for demanding industrial applications. Available from Recab, your Nordic partner for Advantech computer-on-module solutions.

manufacturer

Advantech

product model

SOM-5883

Overview

The Advantech SOM-5883 is a feature-rich COM Express Basic Type 6 module built on Intel 11th Generation Core processors, codenamed Tiger Lake-H, delivering exceptional embedded computing performance for demanding industrial applications. Supporting processors from dual-core Celeron to 8-core Intel Xeon W-series with up to 24MB L3 cache, this module provides scalable processing power with configurable TDP options from 25W to 45W. The integrated Intel Iris Xe Gen 12 graphics architecture enables quad simultaneous independent displays at up to 4K resolution through three DDI ports supporting HDMI, DVI, and DisplayPort configurations, plus additional VGA and LVDS or eDP outputs. Memory flexibility is outstanding with support for dual-channel DDR4-3200 across four SO-DIMM sockets, enabling up to 128GB capacity with ECC support on Xeon variants for mission-critical reliability. The module delivers next-generation connectivity with PCIe Gen4 x16 expansion configurable as dual x8 or x8 plus dual x4, eight PCIe Gen3 lanes, four USB 3.2 Gen2 ports at 10Gbps, eight USB 2.0 ports, four SATA III ports, and Intel 2.5GbE Ethernet. Security features include optional TPM 2.0, while iManager and DeviceOn software support enables comprehensive system management and edge AI capabilities. Extended temperature variants rated from -40 to 85°C address harsh environment deployments in transportation, outdoor infrastructure, and industrial automation. The compact 125mm x 95mm form factor and COM Express R3.0 Type 6 pin-out ensure compatibility with standard carrier boards while delivering workstation-class performance for machine vision, edge computing, medical imaging, and defense applications. Available from Recab, your Nordic partner for Advantech computer-on-module solutions.
Compact, Edge AI Ready, Expandable, Flexible I/O, High Performance, Modular, Wide Temperature

Key highlights

Features

  • Intel 11th Gen Core processors up to 8 cores with 24MB L3 cache and 4.7GHz turbo
  • Intel Iris Xe Gen 12 graphics supporting quad simultaneous independent 4K displays
  • Dual-channel DDR4-3200 memory supporting up to 128GB with ECC on Xeon variants
  • PCIe Gen4 x16 expansion slot configurable as dual x8 or x8 plus dual x4 lanes
  • Extended operating temperature range from minus 40 to 85 degrees Celsius available
  • Comprehensive I/O with USB 3.2 Gen2 at 10Gbps and Intel 2.5GbE Ethernet connectivity

Specifications

Form Factor COM Express Basic Type 6
Pin-out COM Express R3.0 Type 6 compatible
Processor Intel 11th Gen Core i7/i5/i3, Celeron, Xeon W-series (Tiger Lake-H)
Max Cores/Threads 8 Cores / 16 Threads
CPU TDP 25W / 35W / 45W configurable
Memory DDR4-3200, Max 128GB, 4x SO-DIMM, ECC support
Graphics Intel UHD/Iris Xe Graphics, up to 1.35 GHz
Display Output 3x DDI (HDMI/DVI/DP), VGA, LVDS/eDP
PCIe Expansion 1x PCIe x16 Gen4, 8x PCIe x1 Gen3
Ethernet Intel 2.5GbE
USB 4x USB 3.2 Gen2 (10Gbps), 8x USB 2.0
Storage 4x SATA 6Gbps, Optional NVMe SSD
Supply Voltage Vin: 8.5V ~ 20V
Operating Temperature 0~60°C standard, -40~85°C extended
Dimensions 125 mm x 95 mm

Applications

  • Machine vision and edge AI computing systems requiring high-performance graphics
  • Medical imaging equipment demanding reliable processing with ECC memory support
  • Transportation and railway onboard computing in harsh temperature environments
  • Industrial automation controllers with multiple display and expansion requirements

Resources

Datasheet

https://recab.com/wp-content/uploads/2026/06/SOM-5883_DS01162620260116155909.pdf