VITA 93 QMC – Modular Mezzanine I/O Standard by TEWS Technologies

VITA 93 QMC represents a groundbreaking advancement in mezzanine card technology from TEWS Technologies, designed to address the limitations of traditional standards like PMC and XMC in modern embedded systems. Born from the VITA 90 VNX+ working group development, QMC delivers a highly modular, flexible, and scalable I/O architecture that meets stringent size, weight, and power requirements across aerospace, defense, industrial, medical, and transportation sectors. The standard introduces four scalable card sizes from single QMC at 26 mm x 78.25 mm up to quad configurations, supporting PCIe x4 through x16 lanes and 40 to 160 I/Os respectively. A key innovation is the unified thermal management approach where air-cooled and conduction-cooled cards share the same base design, with conduction cooling achieved by adding a skyline heatsink. This eliminates the need for separate product variants and simplifies system integration. The architecture supports PCIe Gen 6 with backward compatibility, utilizing Samtec AccelerateHD connectors for reliable high-speed performance. Variable stacking heights of 9, 11, 14, and 16 mm maximize component envelope utilization on carriers while ensuring universal compatibility between any QMC card and carrier regardless of manufacturer. The I/O structure organizes signals into IOPIPEs with individual grounds supporting isolated interfaces. TEWS Technologies offers the industry’s most comprehensive QMC portfolio including modules for serial interfaces, FPGAs, Ethernet, ADCs, DACs, TTL, and CAN, along with carriers for VPX, PCIe, CompactPCI Serial, and VNX+ platforms. The standard also includes VITA 93.1 QTM transition modules for front panel I/O routing. Available from Recab, your Nordic partner for TEWS Technologies embedded I/O solutions.