COM-HPC: The New Embedded Formfactor
New specification for Com Modules. More performance and new standards like PCIe Gen4 with up to 65x PCIe on COM-HPC Server.
The COM-HPC Client Module Type targets use in high end embedded client products that need one or more displays, a full set of low, medium, and very high bandwidth I/O, powerful CPUs, and modest size. Typical uses are in medical equipment, high end instrumentation, industrial equipment, casino gaming equipment, ruggedized field PCs, transportation and defense systems, and much more. Client Modules typically will use SO-DIMM or soldered–down memory. Up to four SO-DIMM memories may be supported on COM-HPC PCB Size C (160 mm x 120 mm).
The COM-HPC Server Type targets use in high-end headless (no display) embedded servers that require intensive CPU capability, large memory capacity, and lots of high bandwidth I/O including multiple 10Gbps or 25Gbps Ethernet, and up to 65 PICe lanes, at up to PCIe Gen 5 speeds.
Typical uses are in embedded server equipment ruggedized for use in field environments and applications such as autonomous vehicles, cell tower base stations, geophysical field equipment, medical equipment, defense systems, and much more. Server Modules will typically use full-size DIMMs. The Server Modules are typically larger than the Client Modules, but Server vendors are free to use any of the five defined COM-HPC module sizes. The sizes varies from 95mmx120mm up to 200mmx160mm.
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