VP B1x - msd

SKU: VP B1x - msd  /  

VP B1x/msd is a VME board based on the 4th generation Intel® Core™ processor range providing improved processing and graphics capabilities. Designed as a successor to the VP 92x/x1x family, VP B1x/msd provides one or two PMC/XMC sites for local expansion combined with compatible front panel connections for ease of migration. The VMEbus interface is implemented using the Universe II bridge device with the expectation that VP B1x/msd will sustain existing VME solutions for many years. VP B1x/msd also has build options for additional video, Ethernet, audio and GPIO on the P0 connector making it suitable for applications in the defense, industrial control, telecoms, scientific and aerospace markets. A conduction-cooled variant is also available to cater for highly rugged situations requiring zero airflow.

 
  • 4th generation Intel® Core™ processor:
    • 4-core or 2-core Intel processor
    • includes Intel® Advanced Vector Extensions 2 (AVX2)
    • includes Intel® AES New Instructions (AES-NI)
  • Up to 32 Gbytes of soldered DDR3L-1600 DRAM with ECC
  • Dual or single PMC/XMC module sites:
    • 32/64-bit, 33/66 MHz PCI™, up to 100 MHz PCI-X™
    • XMC module interface, x8 PCI Express® (Gen 1, Gen 2)
  • up to 4 x 10/100/1000 Mbps Ethernet interfaces:
    • supports VME64x backplane (VITA 31.1)
  • Up to 4 x external SATA interfaces via the rear
  • Option for an on-board SATA 2.5-inch mass storage drive and option for an on-board CFast™ or SATA Flash Module
  • 3 x serial interfaces and up to 12 x USB interfaces
  • 1 x VGA and up to 2 x DVI-D graphics interfaces plus option for 1 x DisplayPort interface
  • Up to 12 x GPIO signals
  • 8 Mbytes of BIOS Flash EPROM, dual devices
  • Watchdog timer; Long Duration Timer
  • VME-64 Interface:
    • A32/A24/A16/D64/D32/D16/D8(EO), MBLT modes
  • Optional Fast Boot solution based on the Intel® Firmware Support Package (Intel® FSP)
  • Optional High Definition stereo audio (on-board CoDec)
  • Optional support for:
    • Built-In Test (BIT) firmware and software
    • board-level security package
    • Trusted Platform Module (TPM)
    • rear I/O via Rear Transition Module (RTM)
  • Extended temperature versions (E and K-Series):
    • E: -25°C to +70°C
    • K: -40°C to +85°C, humidity sealant
  • Rugged conduction-cooled versions (RC-Series):
    • conduction-cooled to ANSI/VITA 30.1-2002
    • -40°C to +85°C (at card edge), conformally coated
  • Support for Linux®, Windows® and VxWorks®

TOP